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SYLLABUS, Abbreviated
ENME 489F/808K, Microelectromechanical Systems (MEMS) Part 1
Fall 2007


Course Description

In this introductory MEMS class, we cover the fundamental basis of microsystems technology. Microelectromechanical devices (MEMS), such as actuators, pressure sensors, and opto-mechanical assemblies, require knowledge of a broad range of disciplines, from microfabrication and mechanics to chemistry and solid state device physics. These topics are covered in this demanding course, which includes a mandatory laboratory component.

489F vs. 808K

Students (both undergraduate and graduate) can register for either 489F or 808K, as they wish. Students registered for 808K will do additional assignments and homework problems and have extra problems on quizzes and exams.

Lecturer

Dr. Elisabeth Smela
office: 2182 Glenn L. Martin Hall
phone: x55265
email: smela@umd.edu
office hours: tentatively 4-5 Mondays and 11-12 pm Tuesdays or by appointment

Laboratory Instructors

Tom Loughran, Jon Hummel, John Abrahams, and Gerry Becker
Tom: tcl@umd.edu, x5-3642
Jon: jhummel1@umd.edu, x5-5017
John: jabrah@umd.edu, x5-5017
Gerry: B5004@aol.com, 410-795-6458

Alternate contact:
Jim O’Connor, clean room manager in the Kim Building
joconnor@umd.edu, x5-x5018

Textbook

G. T. A. Kovacs, “Micromachined Transducers Sourcebook”, WCB/McGraw-Hill, Boston, 1998. ISBN 0-07-290722-3

Recommended but not required: B. G. Streetman and S. Banerjee, “Solid State Electronic Devices”, Fifth Edition, Prentice Hall, Saddle River, 2000. ISBN 0-13-025538-6

Class Web Site

Communication between instructor and students outside the classroom will be primarily through Blackboard (https://bb.eng.umd.edu).

Introduction

This course is the introductory MEMS offering at the University of Maryland. It will prepare you for more advanced study (courses such as ENME 602, MEMS Device Physics and Design; ENME 808U, Microfluidics and BioMEMS, and ENEE719R Advanced Topics in Microelectronics: Design and Fabrication of Micro-Electro-Mechanical Systems, or graduate study in MEMS).

Material

Classroom

The book for the course, Kovacs, is an excellent, valuable resource for those students who continue in this field. I will use classroom time to supplement the material in the book and answer any questions you have about the reading. Lectures will cover some aspects of what you’ve read in more depth, as well as cover some material that is not covered in the book. We will occasionally have guest speakers.

Lectures will cover semiconductor device physics, microfabrication techniques, fabrication sequences, and mask design. The major components of the first semester of this course will include the topics listed below.

  • Introduction to MEMS
    transducers, markets, information resources
  • MEMS Fabrication Processes and Materials
    bulk micromachining, wet etching, dry etching, surface micromachining, sacrificial layers, film deposition, bonding, sacrificial layers, non-traditional micromachining
  • Introduction to Solid State Devices
    crystal lattices, basic atomic physics, band structure, semiconductors, band structure, doping, p-n junctions, transistors

We will mix device physics and MEMS in the lectures. Semiconductor device physics is covered because mechanical engineers do not have the necessary background to study MEMS, which arose from Si chip technology, and it cannot be understood properly without this knowledge. Everything written in this field presumes that the reader has this background.

Laboratory Component

The lab will give you the opportunity to get hands-on experience with basic processing steps. The class has several 3-hour slots a week. You will thus have one lab period every three weeks in groups of no more than six, with 4 labs total during the semester. Because of the constraint on the lab time, class enrollment is limited. Lab times will be scheduled around the schedules of the students in the class, so that everyone is able to attend. You are responsible for showing up at your lab slot on time.

The labs will be held in the Kim building clean room teaching lab. The lab topics are as follows.

  • lab 1
    safety, MSDSs, photolithography (resist spinning, alignment, exposure, development)
  • lab 2
    metal etching, stripping of resist, alignment to a previous pattern
  • lab 3
    wet etching of oxide and KOH etching of Si
  • lab 4
    device testing

All supplies needed for the labs will be provided.

Assessment

The course grade will be calculated as follows. Point breakdowns for each of these major components will be posted online. Grading will not be on a curve.

Quizzes 5%
Homework 15%
Exam 1 25%
Exam 2 25%
Final Exam 30%
TOTAL
100%

Assignments

Reading

Students are expected to have done the assigned reading for each lecture and should be prepared to discuss it in class. A quiz will be given on every reading assignment during the first few minutes of class.

Homework

Homework assignments and problem solutions will be posted online. Students should view homeworks as learning experiences. Each student should hand in his/her own version of the homework, and this should not be copied from another student; you should work through the problems on your own. Homework problems that are seriously attempted will be given full credit.

Exams

There will be two in-class exams and a final. Exams will be comprehensive.

Course Objectives

The goals of the course are for you to:

  1. know what types of MEMS devices there are and when it makes sense to fabricate one;
  2. understand the micromachining techniques, including what they are, when and how to use them, and what needs to be considered when using them;
  3. know the materials that can be used in MEMS, what they can be used for, and how they can be deposited and etched;
  4. demonstrate proficiency in designing process sequences;
  5. understand the basic concepts of semiconductor device physics;
  6. pay attention to the important things in the laboratory and follow good lab practice;
  7. be able to perform basic photolithography and patterning steps;
  8. develop life-long learning skills, including learning how to find and learn to read the MEMS literature (journal articles, conference proceedings, course book); and
  9. gain experience with applying the engineering method (808K):
    - Articulate the objective to be achieved.
    - Generate a set of candidate plans for achieving the objective.
    - Evaluate each candidate in light of relevant circumstances.
    - Decide which plan is best suited to achieve the stated objective.
    - Pursue the consequences of the decision.

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